LOCTITE SI 5611F
Harmonization Code : 3208.20.90 | Paints and varnishes that are dispersed or dissolved in a non aqueous medium
Main features
- Self-Leveling Electronic Encapsulation
- Fast Tack-Free Cure Profile
- High-Resistivity Silicone Insulation
Product Description
LOCTITE SI 5611F is a two-part, self-leveling alkoxy silicone potting compound for electronic encapsulation. Part A and Part B mix 10:1 by volume to form a gray liquid, with reaction at room temperature and secondary cure from atmospheric moisture. The mixed material has a typical specific gravity of 1.22 and a typical tack-free time of 6 minutes; skin-over time is typically 6 to 18 minutes at 25 +/- 2 deg C and 50 +/- 5% RH. Typical properties after a 7-day cure at 22 deg C and 50% RH include a Tg of -57 deg C, thermal conductivity of 0.32 W/(m K), volume resistivity of 3.5 x 10^14 ohm cm, and dielectric breakdown strength of 19.8 kV/mm.
Key features
- Two-part volume-ratio mixing: The two-component system uses a 10:1 Part A-to-Part B mix ratio by volume.
- Self-leveling application and tack-free time: Low-viscosity, self-leveling silicone has a typical tack-free time of 6 minutes.
- Cured electrical insulation: Typical cured values include 3.5 x 10^14 ohm cm volume resistivity and 19.8 kV/mm dielectric breakdown strength.
Applications
Electronic encapsulation.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Other Properties
Additional Information
As-supplied properties
Part A and Part B values are identified separately.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Part A specific gravity | 1.34 | - | Typical; 25 deg C |
| Part A viscosity | 3,500 to 10,000 | mPa s | Typical; cone and plate; 25 deg C; spindle 20; 20 s^-1 |
| Part B specific gravity | 1.08 | - | Typical; 25 deg C |
| Part B viscosity | 3,000 to 10,000 | mPa s | Typical; cone and plate; 25 deg C; spindle 20; 20 s^-1 |
Cured properties and performance
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass transition temperature (Tg) | -57 | deg C | Typical; cured 7 days at 22 deg C / 50% RH |
| Elongation at break | 59 | % | Typical; ISO 527-3; cured 7 days at 22 deg C / 50% RH |
| Tensile strength | 2 | N/mm^2 | Typical; ISO 527-3; cured 7 days at 22 deg C / 50% RH |
| Thermal conductivity | 0.32 | W/(m K) | Typical; cured 7 days at 22 deg C / 50% RH |
| Volume resistivity | 3.5 x 10^14 | ohm cm | Typical; IEC 60093; cured 7 days at 22 deg C / 50% RH |
| Dielectric breakdown strength | 19.8 | kV/mm | Typical; IEC 60243-1; cured 7 days at 22 deg C / 50% RH |
