LOCTITE 3627

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE 3627

Main features

  • High-Speed SMD Dotting
  • Dual Syringe-Stencil Processing
  • Lead-Free Wave-Solder Compatibility

Product Description

LOCTITE 3627 combines a one-part red epoxy formulation with syringe dispensing and stencil-print capability for high-speed SMD attachment before wave soldering. The gel-like material provides a high dot profile and high wet strength during component placement. Once the adhesive reaches 150 deg C, typical residence time is 90 to 120 seconds. Process testing includes lead-free wave soldering with water- and alcohol-based fluxes under the specified preheat, wave, and component-dot conditions. Applications include syringe- or stencil-applied SMD-to-PCB bonding and small-parts assembly.

Key features

  • Dual Dispense Methods: Ready-to-use syringe dispensing and stencil-print processing are both supported.
  • High-Speed Dot Placement: High dispense speed, high dot profile, and high wet strength support SMD placement before cure.
  • Lead-Free Wave Process: Lead-free wave-solder testing used specified water- and alcohol-based fluxes and component-dot conditions.

Applications

High-speed syringe or stencil-print bonding of SMD components to printed circuit boards before wave soldering and supported small-parts assembly.

Product Family

LOCTITE 3627

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Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Red gel-like material
Chemistry Type
Epoxy
Density (g)
1.16 g/cm3
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.3
Other Properties
Storage Temperature
2 °C to 8 °C
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
105 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.3 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
62×10¹⁵ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
AppearanceRed gel-like materialUncured; typical
Specific gravity1.3DimensionlessTypical at 25 deg C
Particle sizeLess than 100umAs supplied
Yield point100 to 275PaLMS; cone and plate rheometer, Haake PK 100, 2 deg cone, 25 deg C
Casson viscosity2 to 5Pa sCone and plate rheometer, Haake PK 100, 2 deg cone, 25 deg C
Typical heat cure90 to 120seconds150 deg C after adhesive reaches cure temperature
Isothermal DSC conversionAt least 75%LMS; 5 minutes at 125 deg C
Technical properties

After-processing / final-state properties

Bulk and SMD bond-test values use different cure schedules; each row retains its applicable condition.

PropertyValueUnitMethod / condition
Thermal expansion coefficient75 x 10^-6K^-1ISO 11359-2; 26 to 56 deg C; cured 30 minutes at 150 deg C
Thermal expansion coefficient111 x 10^-6K^-1ISO 11359-2; 90 to 150 deg C; cured 30 minutes at 150 deg C
Thermal conductivity0.3W/(m K)ISO 8302; cured 30 minutes at 150 deg C
Density1.16g/cm^3BS 5350-B1; 25 deg C; cured 30 minutes at 150 deg C
Glass transition temperature105deg CASTM D 4065; cured 30 minutes at 150 deg C
Volume resistivity62 x 10^15ohm cmIEC 60093; cured 30 minutes at 150 deg C
Pull-off strength58NSiemens SN59651; C-1206 on bare FR4; cured 90 seconds at 150 deg C
Torque strength55N mmIPC SM817, TM-650 2.4.42; C-1206 on bare FR4; cured 90 seconds at 150 deg C

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