EPOCAP 15144
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- 150-Minute Room-Temperature Gel Time
- 0.0012 in./in. Linear Shrinkage
- 552 Volts/Mil Dielectric Strength
Product Description
EPOCAP 15144 is a room-temperature-curing, two-component epoxy encapsulation system for low-voltage applications. Part A and Part B mix at 100:90 by weight or 1:1 by volume. The mixed system has a typical viscosity of 18,000 cP at 25 deg C and a 150-minute gel time for a 100 g mass. Recommended cure schedules are 7 days at 25 deg C or 2 hours at 49 deg C. Historical cured properties include Shore D 85 hardness, 0.0012 in./in. linear shrinkage, thermal-shock resistance, and electrical-insulation properties. Applications include ballasts, starters, mercury switches, and general electrical potting.
Key features
- Historical Gel Time: For a 100 g mixed mass at 25 deg C, gel time is 150 minutes.
- Historical Linear Shrinkage: Linear shrinkage is 0.0012 in./in., with very low exotherm.
- Historical Electrical Insulation: Cured dielectric strength is 552 volts/mil at 25 deg C, with 5.9 x 10^14 ohm-cm volume resistivity.
Applications
Low-voltage ballasts; starters; mercury switches; general electrical potting and encapsulation.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Chemical Properties
Other Properties
Additional Information
As-supplied / before-processing properties
Legacy-source typical Part A, Part B, and mixed-system values.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Part A viscosity | 12,000 | cP | Legacy source; typical; 25 deg C |
| Part B viscosity | 16,000 | cP | Legacy source; typical; 25 deg C |
| Mixed viscosity | 18,000 | cP | Legacy source; typical; 25 deg C |
| Mix ratio | 100:90 | parts by weight | Legacy source; Part A:Part B |
| Mix ratio | 100:100 | parts by volume | Legacy source; Part A:Part B |
| Mixed specific gravity | 1.64 | - | Legacy source; typical; 25 deg C |
| Gel time | 150 | minutes | Legacy source; 100 g mass at 25 deg C |
| Shelf life | 12 | months | Legacy source; Part A and Part B in separate sealed containers |
After-processing / final-state properties
Legacy-source typical cured-system values; cure schedule is 7 days at 25 deg C or 2 hours at 49 deg C.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Shore hardness | D 85 | - | Legacy source; typical; 25 deg C |
| Tensile strength | 2,670 | psi | Legacy source; typical; 25 deg C |
| Compressive strength | 12,567 | psi | Legacy source; typical; 25 deg C |
| Linear shrinkage | 0.0012 | in./in. | Legacy source; typical; 25 deg C |
| Water absorption | 0.18 | % weight gain | Legacy source; 24-hour immersion at 25 deg C |
| Recommended service temperature | 105 | deg C | Legacy source |
| Dielectric strength | 552 | volts/mil | Legacy source; typical; 25 deg C |
| Volume resistivity | 5.9 x 10^14 | ohm-cm | Legacy source; typical; 25 deg C |
