DOWSIL SE 4410

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

DOWSIL SE4410

Main features

  • 6-Hour Pot Life at 25 deg C
  • 0.92 W/(m K) Thermal Conductivity
  • 24 kV/mm Dielectric Strength

Product Description

DOWSIL SE 4410 Encapsulant is a two-part, 1:1 polydimethylsiloxane encapsulant for electronic assemblies requiring heat dissipation and electrical insulation. The mixed material has a typical viscosity of 3,000 cP and a 6-hour pot life at 25 deg C, with a 60-minute heat cure at 150 deg C. After cure, typical properties include Shore A 88 hardness, 1,030 psi tensile strength, 50% elongation, 24 kV/mm dielectric strength, and 0.92 W/mK thermal conductivity. The cured elastomer is designed for PCB protection where heat transfer is important and does not require a post-cure.

Key features

  • 6-Hour Mixed-Material Pot Life: Typical pot life applies to the mixed encapsulant before cure.
  • 0.92 W/(m K) Thermal Conductivity: Typical thermal-conductivity value applies to the cured encapsulant.
  • 24 kV/mm Dielectric Strength: Typical dielectric-strength value applies to the cured material.

Applications

Encapsulation and protection of electronic assemblies requiring thermal conduction and electrical insulation.

Product Family

DOWSIL SE 4410

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two Part
Mix Ratio
The amount of a constituent divided by the total amount of all other constituents in a mixture
1:1
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
6 hours
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.15
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
50 %
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
24 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
4E+15 Ohms⋅cm
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.92 W/m.K

Additional Information

Technical properties

As-supplied / before-processing properties

Processing values apply to the mixed two-part SE 4410 encapsulant system.

PropertyValueUnitMethod / condition
Mixed viscosity3,000cPTypical; mixed material
Pot life6h25 deg C
Heat-cure schedule60min150 deg C
Technical properties

After-processing / final-state properties

PropertyValueUnitMethod / condition
Specific gravity2.15Typical cured material
Shore A hardness88Typical cured material
Tensile strength1,030psiTypical cured material
Elongation50%Typical cured material
Dielectric strength24kV/mmTypical cured material
Thermal conductivity0.92W/mKTypical cured material

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