DOWSIL SE 1816 CV

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

DOWSIL SE1816

Main features

  • Working Time Greater Than 1,440 Minutes
  • 60-Minute Cure at 100 deg C
  • Self-Priming Electronics Encapsulation

Product Description

DOWSIL SE 1816 CV Kit is a two-part, 1:1 black silicone encapsulant with heat-accelerated cure for potting PCB assemblies, LED lamps, and luminaires. The material is medium viscosity, firm, and self-priming, with a working time greater than 1,440 minutes at 25 deg C and a 60-minute heat cure at 100 deg C. Typical final properties include Shore A 35 hardness, dielectric strength of 650 V/mil, and thermal conductivity of 0.42 W/mK. Its electronics protection functions include encapsulation, stress relief, mechanical protection, electrical insulation, and environmental protection.

Key features

  • 1:1 Two-Part Mixing: Parts A and B form the equal-ratio black silicone encapsulant system.
  • 60-Minute Cure at 100 deg C: The listed heat-cure condition applies to the mixed encapsulant.
  • Self-Priming Encapsulation: Documented uses include PCB and LED potting applications.

Applications

PCB assembly potting; LED lamp and luminaire encapsulation; stress relief, mechanical protection, electrical insulation, and environmental protection.

Technical Specifications

General Properties
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two (A | B)
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
> 24 hours
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.35
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
230 %
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
26 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.6E+15 Ohms⋅cm
Thermal Properties
Temperature Range
-45 to 150 °C

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
Working time>1,440min25 deg C
Heat-cure schedule60min100 deg C
Specific gravity1.3525 deg C
Technical properties

After-processing / final-state properties

PropertyValueUnitMethod / condition
Shore A hardness35Typical final material
Dielectric strength650V/milTypical final material
Thermal conductivity0.42W/mKTypical final material

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