COOLTHERM SC-6709/SC-6731

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

COOLTHERM SC-6709/SC-6731

Main features

  • 100:0.5 Weight Mixing
  • 12 to 16 Hour Room-Temperature Cure
  • 21.7 kV/mm Dielectric Strength

Product Description

CoolTherm SC-6709/SC-6731 Silicone Encapsulant System is a two-part, solvent-free RTV silicone system for potting and encapsulating electrical and electronic components. SC-6709 is a white resin with a typical viscosity of 32,000 cP at 25 deg C and mixes with SC-6731 hardener at 100:0.5 by weight. The mixed system has a typical gel time of 1 to 2 hours at 25 deg C and cures in 12 to 16 hours at 25 deg C. Typical cured properties include 1.0 W/(m K) thermal conductivity, 50 Shore A hardness, 2.14 MPa tensile strength, and 21.7 kV/mm dielectric strength.

Key features

  • Resin-to-hardener mix ratio: SC-6709 resin and SC-6731 hardener combine at 100:0.5 by weight.
  • Room-temperature cure: The mixed system typically cures in 12 to 16 hours at 25 deg C after a 1 to 2 hour gel time.
  • Cured dielectric strength: Typical cured dielectric strength is 21.7 kV/mm.

Applications

Potting and encapsulation of electrical and electronic components using SC-6709 resin with SC-6731 hardener.

Product Family

COOLTHERM SC-6709/SC-6731

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
SC-6709: White Liquid
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
SC-6709: 1.80
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
SC-6709: 32,000 mPa.s
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.0 W/m.K
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
115 %
Chemical Properties
Moisture absorption
0.08 %
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
21.7 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1 x 10^15 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

SC-6709 resin and SC-6731 hardener are separate components; mixed-system data apply to the documented 100:0.5 by-weight combination.

PropertyValueUnitMethod / condition
Appearance, SC-6709 resinWhite liquidTypical
Viscosity, SC-6709 resin32,000cPTypical; 25 deg C
Specific gravity, SC-6709 resin1.80Typical; 25 deg C
Mix ratio, resin:hardener100:0.5by weightSC-6709 resin with SC-6731 hardener
Gel time1 to 2hTypical; SC-6709/SC-6731; 25 deg C
Technical properties

Cured encapsulant properties

Cured properties are typical for the SC-6709 silicone system; the current TDS states they are the same regardless of the documented hardener used.

PropertyValueUnitMethod / condition
Thermal conductivity1.0W/(m K)Typical; Hot Disc Transient Method; ISO 22007-2
Coefficient of linear thermal expansion50ppm/deg CTypical
Hardness50Shore ATypical
Tensile strength2.14MPaTypical; 25 deg C
Elongation at break115%Typical
Volume resistivity1 x 10^15ohm-cmTypical; 25 deg C
Dielectric strength21.7kV/mmTypical; ASTM D149

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