COOLTHERM 6055
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Convenient 1:1 Volume Mixing
- Room-Temperature or Accelerated Cure
- Dielectric Epoxy Encapsulation
Product Description
Circalok 6055 Epoxy Encapsulant is a two-component epoxy system for casting and encapsulating electrical and electronic assemblies. The 6055 A resin and 6055 B hardener mix at a convenient 1:1 ratio by volume, producing a mixed viscosity of 4,000 cP at 25 deg C and a typical one-hour working life for a 100 g mass. The system cures for 24 hours at 25 deg C or 2 hours at 60 deg C. Typical cured properties include Shore D 77 hardness, 20.7 MPa tensile strength, 390 V/mil dielectric strength, and 8.6 x 10^13 ohm cm volume resistivity.
Key features
- 1:1 Volume Mixing: The 6055 A resin and 6055 B hardener mix at a 1:1 ratio by volume for straightforward proportioning.
- Accelerated Cure Option: Cures in 24 hours at 25 deg C or 2 hours at 60 deg C.
- Cured Electrical Properties: Typical cured volume resistivity is 8.6 x 10^13 ohm cm and dielectric strength is 390 V/mil.
Applications
Casting and encapsulation of electrical and electronic assemblies.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Electrical Properties
Additional Information
As-Supplied Properties
Values distinguish the 6055 A resin, 6055 B hardener, and mixed material.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| 6055 A resin viscosity | 12,000 | cP | Typical; 25 deg C |
| 6055 B hardener viscosity | 600 | cP | Typical; 25 deg C |
| Mixed viscosity | 4,000 | cP | Typical; 25 deg C |
| 6055 A resin specific gravity | 1.17 | Typical | |
| 6055 B hardener specific gravity | 0.95 | Typical | |
| Mixed specific gravity | 1.06 | Typical | |
| Mix ratio by volume | 1:1 | 6055 A resin to 6055 B hardener |
Final-State Properties
Typical cured properties for the mixed 6055 system.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Volume resistivity | 8.6 x 10^13 | ohm cm | Typical; cured; 25 deg C; ASTM D257 |
| Hardness | 77 | Shore D | Typical; cured; ASTM D2240 |
| Tensile strength | 20.7 | MPa | Typical; cured; ASTM D638 |
| Dielectric strength | 390 | V/mil | Typical; cured |
